As you all may have known, the Galaxy S9 and Galaxy S9+ have been rumored to get announced during the month of February, which could be before or after the MWC 2018 trade show. The release date according to a Chinese source claims that both phones are scheduled for an early March release date but the internals are going to be stacked together a little different than what other phones feature.
There is a speculation that Samsung’s high-end phones will feature a stacked system board that saves on interior space. The iPhone X features the same motherboard design, which is exactly how the company managed to fit in two batteries and give it an overall battery capacity that is slightly smaller than the cell present in the iPhone 8 Plus.
These circuit boards are known as advanced SLP (Substrate Like PCB) circuit boards. The overall surface area of these boards will be significantly reduced, allowing the chips soldered onto them to be packed tightly together, giving manufacturers the options to ship out those phones with bigger batteries. Since phones are now coming with larger screens but with thinner bezels, the overall size of these phones is actually reducing, which does not give manufacturers a whole lot of space to work with.
This would explain why the Galaxy S8 only has a 3,000mAh battery despite having a 5.8-inch screen. The hardware is said to be superior on the larger Galaxy S9+ though. A dual camera and 6GB of RAM has been reported multiple times on the Galaxy S9+ but that does not mean Samsung will let you off the hook this easily.
The Galaxy S9+ will certainly come with a larger price tag, and if you want to obtain access to better features, you’d best be ready to pay more money.
