Samsung explains its unique cooling system featured in Galaxy S7 and S7 edge

You might remember the news we gave you when the Galaxy S7 and S7 edge got disassembled with a simple heat-gun by a Russian tech blogger, just hours after its official unveiling. The operation revealed the fact that the all new flagship Galaxy S7 features a liquid cooling technology inside. Although no exact details of the technology were outed at that stage, reports claimed that it is built on some intricate flat copper piping with a tiny amount of coolant inside tasked to take the heat away from the Snapdragon 820 and Exynos 8890 chipset. The revelation was soon followed by a confirmation from Samsung which stated that the smartphones do indeed come standard with the aforementioned cooling system. They further said, “the cooling system in these phones, with a very thin thermal spreader, keeps devices cool, so gamers can focus on winning.

However, Today the Samsung came released an extensive interview with their engineers who designed this amazing cooling system. Apparently the unique heat pipe featured in the flagship series is the thinnest in the world, with 0.4mm in diameter and 0.2mm in width.

It was mentioned in the interview that the heat extracting equipment available in the market wasn’t getting the job  done for Samsung. So they went ahead and made one of their own. The “cool” engineers carried own multiple experiments with different alloys inside the pipe, in addition to that, they figured out the best possible placement for such cooling system to make sure that it does not compromises the structural rigidity/strength of the smartphone. After they succeeded in their mission, they had developed a thermal spreader which was able to conduct heat 50 times more than pure copper.


See also: Reportedly, Samsung is making 100 million AMOLED panels for Apple

The flat heat pipes have a tiny amount of water inside them which converts to steam near the processor and carries the heat to the other end when it cools down and condenses to repeat the process. This process effectively and evenly spreads the heat around the handset. As a result, heat does not accumulate around the CPU/GPU to adversely affect their performance, thus ensuring the maximum output from your smartphone. Let us know what you think of this technology in the comment box below.

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