Though we have already heard rumors of the MT Helio X30 SoC, detailed reports just surfaced. Pan Jiutang, analyst, posted AnTuTu benchmark test of the new MediaTek Helio X30 Chipset on Weibo. Apparently the new chipset will use a 10 nanometer manufacturing process which will allow them to build 10 CPU cores inside the chip. The cortex-A35 will be dedicated for low power requiring tasks while heavy duties will be managed by the new Artemis.
Unfortunately the analyst didn’t provide us with the internal specifications of the chipset, but fret not, previous reports suggest that the X30 will feature 2.8GHz Artemis cores, four 2.2GHz Cortex-A53 cores and four 2GHz Cortex-A35 cores. On the other hand, the PowerVR 7XT GPU will be responsible for the graphics. In addition to that, MT Helio X30 will be capable of supporting a dual camera set up, a 26MP camera, VR connections, LTE Cat.13 connectivity, and 8GB of RAM.
The above attached AnTuTu benchmark test scores posted by Jiutang put the new chipset on the top with an amazing 160,000 points. This score beats the well-known Qualcomm Snapdragon 820 SoC with 30,000 points, thus landing it on second position. For those who haven’t heard of the SD820 SoC, it is currently Qualcomm’s latest and best chip available in the market. This chip has been used in major flagships like Samsung Galaxy S7 (U.S. and China), LG G5 and the HTC 10. On the third position, MediaTek’s first deca-core chip, Helio X20 SoC, resides with a score of 100,000.
The analyst further mentioned that the company is still working on the power consumption of the new chipset, which will probably put its unveiling somewhere in 2017. We haven’t yet heard of any device which will feature this monster chipset, but we’ll surely update you as soon as any report pops up. So stay tuned guys.
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