Images of the upcoming Meizu Pro 6 leaked, again

Not long ago, one of Meizu’s own executive confirmed that the upcoming Pro 6 will feature an all new MediaTek Helio X25 chipset. This announced was followed by a benchmark test by GFXBench which all but confirmed the executive’s claim. In addition to the new deca-core CPU, the smartphone will come standard with 4GB of RAM, a fingerprint scanner and a bezel less design.

Today we received another leaked image which featured the upcoming Meizu flagship. You can see the smartphone covered in a black metallic case, a protruding camera and a laser autofocus beneath it. Apparently the Pro 6 will feature the same design as its predecessor, the Meizu Pro 5, however some minor changes are visible.

See also: Check out the press image of the upcoming Huawei P9

Lets have a look at the all new chipset in detail. The MT Helio X25 is basically an enhanced version of the Helio X20. The Helio X25 consists of two Cortex A-72 cores clocked at 2.5GHz to cater high performance duties. In addition to that, we have four Cortex-A53 cores running at 2.0 GHz and four more Cortex-A53 cores with clock speed of 1.4GHz to manage mid-size tasks and low performance tasks respectively.

The Meizu Pro 6 will sport a 5.7″ QHD resolution display. Under the hood it hosts a MediaTek Helio X25 chipset, UFS3.0, Flyme 6.0 OS, fast charging and eMMC5.1 chips. A massive 3500 mAh battery will act as the source of power for the smartphone. Reportedly the Pro 6 will feature 3 GB of RAM. In addition to that, a screenshot shared by Meizu’s VP and Flyme chief architect Yang Yan shows that the flagship will come standard with the famous 3D Touch. Other features include laser autofocus, mTouch fingerprint scanner, 2.5D curved display and a USB Type C port.

Stay tuned for further updates.

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