We recently told you that the Huawei P8 will not be a part of company’s line up at the MWC in Barcelona and will be launched in London on 15th April. Choosing Europe as a launch site for their upcoming smartphone was strategic on Huawei’s part as they want to build brand awareness there and it is where most of their high-end phones get sold. New details about the upcoming Huawei P8 have leaked on the social network Weibo by @Ubuntu团队.
According to the latest information leaked the Huawei P8 will feature a zirconium oxide porcelain uni-body design sporting a dual-sided glass which will most probably be protected by Gorilla Glass 3. Slim smartphones are in trend this year and Huawei’s upcoming smartphone will be no different in this regard, it is reported that the P8 will be even slimmer and sleeker than iPhone6 at 6mm. A dual camera just like the ones seen in the company’s Honor 6 Plus will grace the device. It will also be equipped with a biometric fingerprint sensor.
The details related to the processor which will be used in the device are interesting; the leak suggests that Huawei will be using the Kirin 930 processor which will use the 16nm process. If the detail proves to be true than Huawei P8 will be the first smartphone to use this process. Both Apple A8 an Snapdragon 810 use the 20nm process.
A 2600mAh battery will compliment the handset, which does seem a bit small but we have to keep this in mind that Huawei will not be using a HD display as they want to optimize the battery. The Huawei P8 will be priced at 2999 Yuan which is an equivalent to $480. If the end product features all the specifications mentioned in the leaks then Huawei has a winner in works here. More details related to this nifty device will be emerge in the coming days, we will keep you updated on all the developments on this end.
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